Technologies

IMS

Insulated Metallic Substrate

Characteristics

High density aluminum substrate on one side and a copper laminate on the other side, separated by a dielectric.
High thermal dissipation
Electronics on one side
Low design complexity

Laminate

IMS
IMS (with low density dielectric)

PTH

MLB

SCO

STH / CPTH

FLEXIBLE / ALUFLEX

Characteristics

Design to be able to adapt to any shape required by the designs (irregular shapes or 3D)
Good thermal management

Aluflex (Metallic substrae + Flexible PCB)

Laminate: ALUMINUM + PEN or PI-KAPTON ®
Production capacity: 20.000 m2/month

Flexible PCB

Laminate: PEN, PI-KAPTON ®
Production capacity: 25.000 m2/month

Semiflexible

FR4 + drilling: the flexibility comes from routing.

IMS MAIN FEATURES

		STANDARD	FINE
Min. Track Width	1oz/35um	0,2mm +/-20%	0,18 mm +/-20%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Space Track to Track	1oz/35um	0,2mm +/-20%	0,18 mm +/-20%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Punch Hole Diameter		1,5mm	-
Min. Drill Hole Diameter		1,3mm	1,0mm
Max. Panel Dimension		600mm*500mm	-
Min. Panel Dimension		460mm*300mm	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0,8mm
Min. SM aperture		0,15mm	0,1mm
Min. SM Dam		0,15mm	-

PTH MAIN FEATURES

		STANDARD	FINE
Min. Track Width	1oz/35um	0,2mm +/-20%	0,15 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,15 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Space Track to Track	1oz/35um	0,2mm +/-20%	0,15 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,15 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Drill Hole Diameter		0,4mm	0,25mm
Max. Panel Dimension (WP)		415x593mm	-
Min. Panel Dimension (WP)		229x406mm	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0,8mm
Min. SM aperture		0,15mm	0,12mm
Min. SM Dam		0,15mm	0,12mm

MLB MAIN FEATURES

		STANDARD	FINE
Min. Track Width Ext. Layers	1oz/35um	0,2mm +/-20%	0,2 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Space Track to Track Ext. Layers	1oz/35um	0,2mm +/-20%	0,2 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Track Width Int. Layers	1oz/35um	0,2mm +/-20%	0,2 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
Min. Space Track to Track Int. Layers	1oz/35um	0,2mm +/-20%	0,2 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
Number of layers		Up to 6	Up to 10
Min. Drill Hole Diameter		0,4mm	0,25mm
Max. Panel Dimension (WP)		415x593mm	-
Min. Panel Dimension (WP)		229x406mm	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0,8mm
Min. SM aperture		0,15mm	0,12mm
Min. SM Dam		0,15mm	0,12mm

SCO / STH MAIN FEATURES

		STANDARD	FINE
Min. Track Width	1oz/35um	0,2mm +/-20%	0,2 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Space Track to Track	1oz/35um	0,2mm +/-20%	0,2 mm +/-15%
	2oz/70um	0,2mm +/-20%	0,2 mm +/-15%
	3oz/105um	0,3mm +/-20%	0,3 mm +/-15%
Min. Punch Hole Diameter		0,8mm	-
Min. Drill Hole Diameter		0,6mm	0,4mm
Max. Panel Dimension		660*527	-
Min. Panel Dimension		527*300	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0,8mm
Min. SM aperture		0,15mm	-
Min. SM Dam		0,15mm	-
Min. SCO Bridge		1,5mm	1mm
STH via min. hole		0,6mm	0,4mm

FLEXIBLE MAIN FEATURES

		STANDARD	FINE
Min. Track Width	1oz/35um	0,15mm +/-20%	0,1mm +/-15%
Min. Space Track to Track	1oz/35um	0,15mm +/-20%	0,1mm +/-15%
Number of layers MLB FPCB		Up to 4	Up to 6
Min. Drill Hole Diameter		0,25mm	0,2mm
Min. Punch Hole Diameter		1,0mm	0,8mm
Max. Panel Dimension (WP)		250x250mm	250x600mm
Min. SM aperture		0,15mm	0,12 mm
Min. CVL aperture		0,1mm	0,05mm

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TECHNOLOGIES

Insulated Metallic Substrate

Plated Through Hole

Multilayer

Silver Cross Over

Silver Through Hole / Copper Through Hole

IMS MAIN FEATURES

STANDARD

FINE

PTH MAIN FEATURES

STANDARD

FINE

MLB MAIN FEATURES

STANDARD

FINE

SCO / STH MAIN FEATURES

STANDARD

FINE

FLEXIBLE MAIN FEATURES

STANDARD

FINE

CONTACTO / CONTACT

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