Tecnologías - Eurocir

TECHNOLOGIES

IMS

Insulated Metallic Substrate

Features

Substrate aluminium high thickness on one side and a sheet of copper on the other, separated by a dielectric.
High heat dissipation
Electronic in-1 face
Low-complexity design

Laminate

IMS
IMS (with dielectric of low thickness)

PTH

MLB

SCO

STH / CPTH

FLEXIBLE / ALUFLEX

Features

Designed to adapt to all the forms required by the design (irregular shapes and 3D)
Good thermal management

Aluflex (Metallic substrate + Ci Flexible)

Laminate: ALUMINUM + PEN or PI-KAPTON ®
Production capacity: 20,000 m2/month

Ci Flexible

Laminate: PEN, PI-KAPTON ®
Production capacity: 25,000 m2/month

Semi-flexible

FR4 + drilling: the flexibility is provided by milling of control in Z.

MAIN FEATURES IMS

		STANDARD	FINE
Min. Track Width	1oz/35um	0.2 mm +/-20%	0.18 mm +/-20%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Space Track-to-Track	1oz/35um	0.2 mm +/-20%	0.18 mm +/-20%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Punch Hole Diameter		1.5 mm	-
Min. Drill Hole Diameter		1.3 mm	1.0 mm
Max. Panel Dimension		600mm*500mm	-
Min. Panel Dimension		460mm*300mm	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0.8 mm
Min. SM aperture		0.15 mm	0.1 mm
Min. SM Dam		0.15 mm	-

MAIN FEATURES PTH

		STANDARD	FINE
Min. Track Width	1oz/35um	0.2 mm +/-20%	0.15 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.15 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Space Track-to-Track	1oz/35um	0.2 mm +/-20%	0.15 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.15 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Drill Hole Diameter		0.4 mm	0.25 mm
Max. Panel Dimension (WP)		415x593mm	-
Min. Panel Dimension (WP)		229x406mm	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0.8 mm
Min. SM aperture		0.15 mm	0.12 mm
Min. SM Dam		0.15 mm	0.12 mm

MAIN FEATURES MLB

		STANDARD	FINE
Min. Track Width Ext. Layers	1oz/35um	0.2 mm +/-20%	0.2 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Space Track-to-Track Ext. Layers	1oz/35um	0.2 mm +/-20%	0.2 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Track Width Int. Layers	1oz/35um	0.2 mm +/-20%	0.2 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
Min. Space Track-to-Track Int. Layers	1oz/35um	0.2 mm +/-20%	0.2 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
Number of layers		Up to 6	Up to 10
Min. Drill Hole Diameter		0.4 mm	0.25 mm
Max. Panel Dimension (WP)		415x593mm	-
Min. Panel Dimension (WP)		229x406mm	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0.8 mm
Min. SM aperture		0.15 mm	0.12 mm
Min. SM Dam		0.15 mm	0.12 mm

MAIN FEATURES SCO / STH

		STANDARD	FINE
Min. Track Width	1oz/35um	0.2 mm +/-20%	0.2 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Space Track-to-Track	1oz/35um	0.2 mm +/-20%	0.2 mm +/-15%
	2oz/70um	0.2 mm +/-20%	0.2 mm +/-15%
	3oz/105um	0.3 mm +/-20%	0.3 mm +/-15%
Min. Punch Hole Diameter		0.8 mm	-
Min. Drill Hole Diameter		0.6 mm	0.4 mm
Max. Panel Dimension		660*527	-
Min. Panel Dimension		527*300	-
Max. Panel Thickness		3mm	-
Min. Panel Thickness		1mm	0.8 mm
Min. SM aperture		0.15 mm	-
Min. SM Dam		0.15 mm	-
Min. SCO Bridge		1.5 mm	1mm
STH via min. hole		0.6 mm	0.4 mm

MAIN FEATURES FLEXIBLE

		STANDARD	FINE
Min. Track Width	1oz/35um	0.15 mm +/-20%	0.1 mm +/-15%
Min. Space Track-to-Track	1oz/35um	0.15 mm +/-20%	0.1 mm +/-15%
Number of layers MLB FPCB		Up to 4	Up to 6
Min. Drill Hole Diameter		0.25 mm	0.2 mm
Min. Punch Hole Diameter		1.0 mm	0.8 mm
Max. Panel Dimension (WP)		250x250mm	250x600mm
Min. SM aperture		0.15 mm	0.12 mm
Min. CVL aperture		0.1 mm	0.05 mm

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TECHNOLOGIES

Insulated Metallic Substrate

Plated Through Hole

Multilayer

Silver Cross-Over

Silver Through Hole / Copper Through Hole

MAIN FEATURES IMS

STANDARD

FINE

MAIN FEATURES PTH

STANDARD

FINE

MAIN FEATURES MLB

STANDARD

FINE

MAIN FEATURES SCO / STH

STANDARD

FINE

MAIN FEATURES FLEXIBLE

STANDARD

FINE

CONTACT / CONTACT

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